Sealing porous dielectric materials
US7560165B2 · kind B2 · utility
1Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Jun 7, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may besealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.