Wafer tilt detection apparatus and method
US7561258B2 · kind B2 · utility
1Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2007 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Jan 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary embodiment providing one or more improvements includes a wafer tilt detection apparatus for use with a wafer processing or manufacturing device that applies a process to the wafer and which utilizes an endpoint signal for determining control of the process applied to the wafer. The wafer tilt apparatus uses the endpoint signal in establishing when the wafer was in a tilted orientation during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.