Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
US7563315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2006 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | May 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.