Roger Bernards
20Patents
10h-index
16Co-inventors
72Inventor score
Filing activity: Aug 23, 1988 → May 8, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5252196A | Copper electroplating solutions and processes | Chemistry; Metallurgy | 64 | Expired |
| US5223118A | Method for analyzing organic additives in an electroplating bath | Chemistry; Metallurgy | 42 | Expired |
| US5051154A | Additive for acid-copper electroplating baths to increase throwing power | Electricity | 30 | Expired |
| US5068013A | Electroplating composition and process | Electricity | 17 | Expired |
| US6716281B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Electricity | 16 | Expired |
| US6946027B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Electricity | 15 | Expired |
| US7108795B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Electricity | 15 | Expired |
| US4932518A | Method and apparatus for determining throwing power of an electroplating solution | Electricity | 14 | Expired |
| US7351353B1 | Method for roughening copper surfaces for bonding to substrates | Electricity | 12 | Expired |
| US4897165A | Electroplating composition and process for plating through holes in printed circuit boards | Electricity | 10 | Expired |
| US5004525A | Copper electroplating composition | Electricity | 8 | Expired |
| US7211204B2 | Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA) | Electricity | 6 | Expired |
| US7153445B2 | Method for roughening copper surfaces for bonding to substrates | Electricity | 5 | Expired |
| US7563315B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | Electricity | 3 | Active |
| US6623787B2 | Method to improve the stability of dispersions of carbon | Chemistry; Metallurgy | 2 | Expired |
| US7767009B2 | Solution and process for improving the solderability of a metal surface | Chemistry; Metallurgy | 1 | Active |
| US5395652A | Plating catalyst formed from noble metal ions and bromide ions | Electricity | 1 | Expired |
| US8110252B2 | Solution and process for improving the solderability of a metal surface | Chemistry; Metallurgy | 0 | Active |
| US7591956B2 | Method and composition for selectively stripping nickel from a substrate | Electricity | 0 | Active |
| US10986738B2 | Carbon-based direct plating process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.