Microelectromechanical systems encapsulation process

US7563633B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Markus Ulm · Weilmünster, DE
• Brian Stark · Los Altos, US
• Matthias Metz · Zürich, CH
• Tino Fuchs · Rötteln, DE
• Franz Laermer · Stuttgart, DE
• Silvia Kronmueller · Schwaikheim, DE

Key dates

• Filing date: Aug 25, 2006
• Grant date: Jul 21, 2009
• Expiry date: Aug 25, 2026

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B3/0005
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450 C is described. The coating is applied after device release but before sealing vents in the encapsulation layer. Alternatively, an anti-stiction coating may be applied to released devices directly before encapsulation.