Printed circuit board with embedded capacitors therein and manufacturing process thereof
US7564116B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2008 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.