Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
US7566584B2 · kind B2 · utility
6Cited by
17References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 2, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Jun 30, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an electronic substrate, having a process of embedding electronic components in a substrate, and a process of ejecting liquid droplets containing a conductive material, to form a wiring pattern connected to the external connection electrodes of the electronic components embedded in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.