Light emitting diode package
US7566912B2 · kind B2 · utility
13Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2007 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Jun 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.