Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures
US7566964B2 · kind B2 · utility
1Cited by
29References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2003 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Sep 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device structure and a process for fabricating the structure wherein the power bus interconnect structure is formed in the aluminum pad or contact layer. An interconnect structure for interconnecting underlying levels of interconnect can also be formed in the aluminum pad layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.