Semiconductor acceleration sensor device and method for manufacturing the same
US7568390B2 · kind B2 · utility
13Cited by
15References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2005 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Sep 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.