Method for separating a useful layer and component obtained by said method
US7569152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Jun 28, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/115
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A useful layer (1) is initially attached by a sacrificial layer (2) to a layer (3) forming a substrate. Before etching of the sacrificial layer (2), at least a part of the surface (4, 5) of at least one of the layers in contact with the sacrificial layer (2) is doped. After etching of the sacrificial layer (2), the surface (4, 5) is superficially etched so as to increase the roughness of its doped part. After doping, a mask (9) is deposited on a part of the useful layer (1) so as to delineate a doped zone and a non-doped zone of the surface (4, 5), one of the zones forming a stop after the superficial etching phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.