Package structure for an acceleration sensor
US7571647B2 · kind B2 · utility
17Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2005 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Apr 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to the present invention, a package for an acceleration sensor, includes an acceleration sensor which is proved with a first terminal; a package base; an adhesive layer provided on the package base; and a spacer provided between the adhesive layer and the acceleration sensor. The spacer comprises a second terminal, which is electrically coupled to the first terminal of the acceleration sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.