Cleaning liquid and cleaning method
US7572758B2 · kind B2 · utility
6Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2005 |
| Grant date | Aug 11, 2009 |
| Priority date | — |
| Expiry date | Jan 21, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning liquid is provided, which comprises an aqueous solution containing nitric acid, sulfuric acid, a fluorine compound, and a basic compound. The concentration of water in the cleaning liquid is 80% by weight or more, and the pH value of the cleaning liquid is from 1 to less than 3. The cleaning liquid is effective for removing etching residues formed in a dry etching process from semiconductor devices and display devices without oxidizing and corroding their metal wirings, particularly, copper wirings and the materials of insulating films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.