Process for electrolytically plating copper
US7575666B2 · kind B2 · utility
4Cited by
13References
9Claims
0Family size
Inventors
Key dates
| Filing date | Apr 5, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Sep 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0392
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic compound, preferably incorporating an alkane sulfonate group or groups and/or an alkane sulfonic acid. The second step comprises an electrolytic copper plating solution based on an alkane sulfonic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.