James Watkowski
3Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Mar 22, 2006 → May 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7575666B2 | Process for electrolytically plating copper | Electricity | 4 | Active |
| US7666471B2 | Polyimide substrate and method of manufacturing printed wiring board using the same | Electricity | 0 | Active |
| US12325927B2 | Complex waveform for electrolytic plating | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.