Devices and methods for constructing electrically programmable integrated fuses for low power applications
US7576407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Aug 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrically programmable integrated fuses are provided for low power applications. Integrated fuse devices have stacked structures with a polysilicon layer and a conductive layer formed on the polysilicon layer. The integrated fuses have structural features that enable the fuses to be reliably and efficiently programmed using low programming currents/voltages, while achieving consistency in fusing locations. For example, programming reliability and consistency is achieved by forming the conductive layers with varied thickness and forming the polysilicon layers with varied doping profiles, to provide more precise localized regions in which fusing events readily occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.