Lead frame structure and applications thereof
US7576418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2008 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Jul 3, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.