Integrated circuit probing apparatus having a temperature-adjusting mechanism
US7576553B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Aug 18, 2009 |
| Priority date | — |
| Expiry date | Dec 12, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07342
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.