Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
US7578891B2 · kind B2 · utility
5Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2005 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Jun 28, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/287
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.