Method for forming micropattern
US7579138B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2007 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Jul 23, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a method for forming a micropattern, enabling to narrow intervals between resist patterns, in which the narrowing extent of intervals between resist patterns can be increased while maintaining the controllability of resist pattern dimensions and the good resist pattern shape within a wafer face. The present invention relates a method for forming a micropattern comprising: a coating film formation process for applying a coating composition to form a coating film on a substrate having a resist pattern; a first heating treatment process for heat-treating the coating film; a coating film removal process for removing the coating film after the first heating treatment process; and a second heat treatment process for heat-treating the pattern narrowed after the coating film removal process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.