Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
US7579583B2 · kind B2 · utility
8Cited by
8References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2004 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Nov 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A size reduced solid-state imaging apparatus may be provided. The solid-state imaging apparatus may include a wiring substrate having a body having a cavity on an area which a semiconductor chip may be mounted, a lead that may project inward into the cavity from the internal side of the body, and/or a tie bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.