Method for manufacturing multilayer flexible printed circuit board
US7581312B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 2007 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Oct 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.