FOXCONN ADVANCED TECHNOLOGY INC.
28Patents
28Active
28Granted
49Portfolio score
Filing activity: Jul 21, 2006 → May 14, 2009 · 28 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8009432B2 | Retaining apparatus for a flexible printed circuit board | Electricity | 16 | Active |
| US7897055B2 | Method for manufacturing multilayer flexible printed circuit board | Emerging Cross-Sectional Technologies | 7 | Active |
| US7839647B2 | Insulating film, printed circuit board substrate and printed circuit board including same | Emerging Cross-Sectional Technologies | 5 | Active |
| US7916499B2 | Apparatus for holding printed circuit boards | Electricity | 4 | Active |
| US7488428B2 | Method for forming stacked via-holes in printed circuit boards | Electricity | 4 | Active |
| US7799603B2 | Method for mounting electronic component on printed circuit board | Electricity | 3 | Active |
| US7698811B2 | Method for manufacturing multilayer printed circuit boards using inner substrate | Emerging Cross-Sectional Technologies | 2 | Active |
| US7728232B2 | Printed circuit board assembly having adhesive layer | Emerging Cross-Sectional Technologies | 2 | Active |
| US7758716B2 | Apparatus for spraying etchant solution onto preformed printed circuit board | Emerging Cross-Sectional Technologies | 2 | Active |
| US7338299B1 | Surface mounted electronic component | Emerging Cross-Sectional Technologies | 2 | Active |
| US7511962B2 | Flexible printed circuit board | Electricity | 2 | Active |
| US7418780B2 | Method for forming stacked via-holes in a multilayer printed circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
| US7943490B2 | Method of cutting PCBS | Electricity | 1 | Active |
| US7754623B2 | Apparatus for forming film hole | Electricity | 1 | Active |
| US7985482B2 | Stiffener sheet and flexible printed circuit board using the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7452754B2 | Method for manufacturing flexible printed circuit boards | Electricity | 1 | Active |
| US7854197B2 | Method for manufacturing printed circuit boards using legend printing stencil | Emerging Cross-Sectional Technologies | 1 | Active |
| US7789989B2 | Method for manufacturing rigid-flexible printed circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
| US7581312B2 | Method for manufacturing multilayer flexible printed circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
| US7998332B2 | Electroplating method | Chemistry; Metallurgy | 0 | Active |
| US8042265B2 | Method for manufacturing multilayer flexible printed circuit board | Emerging Cross-Sectional Technologies | 0 | Active |
| US7987586B2 | Method for manufacturing printed circuit board having different thicknesses in different areas | Emerging Cross-Sectional Technologies | 0 | Active |
| US7897199B2 | Method for plating flexible printed circuit board | Electricity | 0 | Active |
| US8001684B2 | Method for manufacturing flexible printed circuit boards | Emerging Cross-Sectional Technologies | 0 | Active |
| US7872744B2 | Visual inspection apparatus for flexible printed circuit boards | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.