LED package using Si substrate and fabricating method thereof
US7582496B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2005 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Dec 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
Abstract
There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.