Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
US7582510B2 · kind B2 · utility
6Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2004 |
| Grant date | Sep 1, 2009 |
| Priority date | — |
| Expiry date | Nov 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.