James T. Huneke
8Patents
6h-index
14Co-inventors
60Inventor score
Filing activity: Jan 18, 1982 → Mar 15, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7312534B2 | Interlayer dielectric and pre-applied die attach adhesive materials | Emerging Cross-Sectional Technologies | 30 | Expired |
| US4574031A | Additive processing electroless metal plating using aqueous photoresist | Electricity | 20 | Expired |
| US7550825B2 | Interlayer dielectric and pre-applied die attach adhesive materials | Emerging Cross-Sectional Technologies | 15 | Active |
| US4374869A | Selective metal etch technique | Electricity | 13 | Expired |
| US8399974B1 | Methods of dicing stacked shingled strip constructions to form stacked die packages | Electricity | 9 | Active |
| US8415812B2 | Materials and methods for stress reduction in semiconductor wafer passivation layers | Electricity | 6 | Active |
| US7582510B2 | Electronic packaging materials for use with low-k dielectric-containing semiconductor devices | Electricity | 6 | Expired |
| US8710682B2 | Materials and methods for stress reduction in semiconductor wafer passivation layers | Electricity | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.