Patent · US Active

Reducing corrosion in copper damascene processes

US7582558B2 · kind B2 · utility

0Cited by

3References

7Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Vinay Chikarmane · Portland, US
Kevin J. Fischer · Hillsboro, US
Brennan Peterson · Portland, US

Key dates

Filing date	Jul 14, 2006
Grant date	Sep 1, 2009
Priority date	—
Expiry date	Jun 18, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/32136
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Copper interconnects may be made using the damascene process with reduced copper corrosion. Copper corrosion may be reduced by planarizing through excess copper down to, but not completely through, a copper diffusion barrier layer. The copper diffusion barrier layer may be removed using a different technique. Thereafter, suitable chemicals may be utilized to clean the structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.