Patent · US Active

Bond and method for bonding two contact surfaces

US7582832B2 · kind B2 · utility

4Cited by

4References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Manfred Reinold · Schwieberdingen, DE
Thomas Kaden · Dresden, DE
Immanuel Mueller · Gomaringen, DE

Key dates

Filing date	Jun 4, 2007
Grant date	Sep 1, 2009
Priority date	—
Expiry date	Jun 20, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49201
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.