Thomas Kaden
7Patents
2h-index
16Co-inventors
44Inventor score
Filing activity: Oct 9, 2003 → Apr 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7582832B2 | Bond and method for bonding two contact surfaces | Emerging Cross-Sectional Technologies | 4 | Active |
| US11480495B2 | Position-tolerance-insensitive contacting module for contacting optoelectronic chips | Physics | 2 | Active |
| US7581667B2 | Tool head for attaching an electrical conductor on the contact surface of a substrate and method for implementing the attachment | Electricity | 2 | Expired |
| US12210057B2 | Wafer-level test method for optoelectronic chips | Physics | 0 | Active |
| US8933546B2 | Electronic assembly with improved thermal management | Electricity | 0 | Active |
| US11906579B2 | Wafer-level test method for optoelectronic chips | Physics | 0 | Active |
| US12203983B2 | Contacting module for contacting optoelectronic chips | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.