Patent · US Active

Mounting and adhesive layer for semiconductor components

US7582909B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Melanie Ring · Birkenfeld, DE
Benjamin Prodinger · Wernberg, AT
Werner Kuhlmann · Stephanskirchen, DE

Key dates

Filing date	Jun 9, 2006
Grant date	Sep 1, 2009
Priority date	—
Expiry date	Jan 27, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An assembly and adhesive layer for semiconductor components is arranged between a silicon support (submount) and an electronic functional element for the formation of an electrically-conducting connection between the silicon support and the functional element. The assembly and adhesive layer are arranged on the support. The assembly and adhesive layer are made from a Ti/TiN layer (6), applied to an aluminum contact surface (5) of the silicon support (1), by means of a deposition method. The aluminum contact surface (5) is located on a landing pad (2) on the silicon support (1).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.