Patent · US Active

Substrates for optical die structures

US7583871B1 · kind B1 · utility

7Cited by

7References

23Claims

0Family size

Inventors

Omar J. Bchir · Phoenix, US
Islam A. Salama · Scottsdale, US
Charan Gurumurthy · Gilbert, US
Houssam Jomaa · San Diego, US
Ravi Kiran Nalla · San Jose, US
Yonggang Li · Chandler, US

Key dates

Filing date	Mar 20, 2008
Grant date	Sep 1, 2009
Priority date	—
Expiry date	Mar 20, 2028

Classification

Technology area (CPC G)Physics
CPC primaryG02B6/43
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate, and one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from a motherboard.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.