Method of applying a pattern of particles to a substrate
US7585549B2 · kind B2 · utility
6Cited by
24References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2004 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Nov 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.