Light emitting diode package structure and fabricating method thereof
US7586125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2006 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Feb 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.