Ming-Ji Dai
35Patents
7h-index
58Co-inventors
68Inventor score
Filing activity: Mar 30, 2006 → Jan 4, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8075182B2 | Apparatus and method for measuring characteristic and chip temperature of LED | Physics | 64 | Active |
| US7633154B2 | Encapsulation and methods thereof | Electricity | 49 | Active |
| US8609454B2 | Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices | Emerging Cross-Sectional Technologies | 18 | Active |
| US7586125B2 | Light emitting diode package structure and fabricating method thereof | Electricity | 12 | Active |
| US8456017B2 | Filled through-silicon via with conductive composite material | Electricity | 9 | Active |
| US7999172B2 | Flexible thermoelectric device | Performing Operations; Transporting | 9 | Active |
| US8552554B2 | Heat dissipation structure for electronic device and fabrication method thereof | Emerging Cross-Sectional Technologies | 8 | Active |
| US8193625B2 | Stacked-chip packaging structure and fabrication method thereof | Electricity | 6 | Active |
| US8674491B2 | Semiconductor device | Electricity | 5 | Active |
| US7952368B1 | Apparatus and method for measuring diode chip | Physics | 5 | Active |
| US8278755B2 | Heat dissipation structure for electronic device and fabrication method thereof | Electricity | 3 | Active |
| US8519524B1 | Chip stacking structure and fabricating method of the chip stacking structure | Electricity | 3 | Active |
| US8008573B2 | Integrated package structure having solar cell and thermoelectric element and method of fabricating the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US9448121B2 | Measurement method, measurement apparatus, and computer program product | Electricity | 1 | Active |
| US10288696B2 | Intelligent diagnosis system for power module and method thereof | Electricity | 1 | Active |
| US8310037B2 | Light emitting apparatus and fabrication method thereof | Electricity | 1 | Active |
| US7972877B2 | Fabricating method of light emitting diode package | Electricity | 1 | Active |
| US8502224B2 | Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor | Electricity | 1 | Active |
| US7517114B2 | Lighting devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US8536701B2 | Electronic device packaging structure | Electricity | 1 | Active |
| US9130080B2 | Encapsulation of backside illumination photosensitive device | Electricity | 1 | Active |
| US8664509B2 | Thermoelectric apparatus and method of fabricating the same | Electricity | 1 | Active |
| US7855396B2 | Light emitting diode package structure | Emerging Cross-Sectional Technologies | 1 | Active |
| US12429914B2 | Flexible display device and electronic device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11532679B2 | Method of fabricating array substrate, array substrate, and display apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.