Electronic circuit component
US7586755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2007 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Mar 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09827
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost.The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.