Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice
US7589338B2 · kind B2 · utility
5Cited by
67References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2007 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Nov 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optocoupler package is disclosed. The package includes a substrate comprising a substrate surface, a first device, and a clip structure attached to the first device. The clip structure and the first device are mounted on the substrate, and the first device is oriented at an angle with respect to the substrate surface. A second device is mounted on the substrate, where the first device is capable of communicating with the second device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.