Yong Liu
116Patents
10h-index
85Co-inventors
79Inventor score
Filing activity: Oct 4, 2006 → Jan 14, 2025
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD968328S1 | Wireless charger | General | 58 | Active |
| USD968327S1 | Wireless charger | General | 38 | Active |
| US8421168B2 | Microelectromechanical systems microphone packaging systems | Electricity | 36 | Active |
| USD980163S1 | Wireless charger | General | 34 | Active |
| US8813201B2 | Generating security material | Electricity | 16 | Active |
| US8247269B1 | Wafer level embedded and stacked die power system-in-package packages | Electricity | 13 | Active |
| US8018054B2 | Semiconductor die package including multiple semiconductor dice | Electricity | 13 | Active |
| US7825502B2 | Semiconductor die packages having overlapping dice, system using the same, and methods of making the same | Electricity | 12 | Active |
| US7768108B2 | Semiconductor die package including embedded flip chip | Electricity | 11 | Active |
| US8082525B2 | Technique for correcting hotspots in mask patterns and write patterns | Physics | 10 | Active |
| US7902646B2 | Multiphase synchronous buck converter | Electricity | 9 | Active |
| US8138585B2 | Four mosfet full bridge module | Electricity | 9 | Active |
| US8106406B2 | Die package including substrate with molded device | Electricity | 8 | Active |
| USD975346S1 | Moon lamp set | General | 8 | Active |
| US8314499B2 | Flexible and stackable semiconductor die packages having thin patterned conductive layers | Electricity | 7 | Active |
| USD967584S1 | Sink rack | General | 7 | Active |
| US8421204B2 | Embedded semiconductor power modules and packages | Electricity | 7 | Active |
| US7934430B2 | Die scale strain gauge | Physics | 6 | Active |
| US7768123B2 | Stacked dual-die packages, methods of making, and systems incorporating said packages | Electricity | 6 | Active |
| US8088645B2 | 3D smart power module | Electricity | 6 | Active |
| USD1040095S1 | Wireless charger | General | 5 | Active |
| US8023279B2 | FLMP buck converter with a molded capacitor and a method of the same | Emerging Cross-Sectional Technologies | 5 | Active |
| US7589338B2 | Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice | Electricity | 5 | Active |
| US8842946B1 | Light sensor having reduced dark current | Physics | 5 | Active |
| US7793253B2 | Mask-patterns including intentional breaks | Physics | 5 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.