Method for forming integrated circuit utilizing dual semiconductors
US7589380B2 · kind B2 · utility
3Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2005 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Jan 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/01
Abstract
A monolithically integrated electronic circuit using two different semiconductor layers which are separated by a dielectric layer. Transistors formed in the upper semiconductor layer are connected to transistors formed in the lower semiconductor layer via conventional wiring. Preferably, one layer of transistors is of one polarity, N-type or P-type, while the second layer of transistors is of the opposite polarity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.