Patent · US Active

Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation

US7589395B2 · kind B2 · utility

1Cited by

9References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Ajit Sathe · Chandler, US
Mathew J. Manusharow · Phoenix, US
Sung Won Moon · Phoenix, US

Key dates

Filing date	Jun 30, 2006
Grant date	Sep 15, 2009
Priority date	—
Expiry date	Jul 31, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit (“IC”) dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.