Semiconductor device
US7589412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2006 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Aug 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/24
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One of the aspects of the present invention is to provide a semiconductor device, which includes a base plate, an insulating substrate on the base plate, and a wiring patterned layer on the insulating substrate. Also, it includes at least one semiconductor chip bonded on the wiring patterned layer, the semiconductor chip having a surface electrode. A main terminal is connected via a conductive adhesive layer onto at least either one of the surface electrode and the wiring patterned layer. Also, a resin package covers the insulating substrate, the wiring patterned layer, the semiconductor chip, the conductive adhesive layer, and at least a portion of the main terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.