Shingo Sudo
9Patents
3h-index
16Co-inventors
50Inventor score
Filing activity: Aug 3, 2006 → Mar 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7589412B2 | Semiconductor device | Electricity | 15 | Active |
| US7671382B2 | Semiconductor device with thermoplastic resin to reduce warpage | Electricity | 10 | Active |
| US7768118B2 | Semiconductor device | Electricity | 7 | Active |
| US11963576B2 | Sole structure for a shoe, shoe having same, and method for manufacturing same | Performing Operations; Transporting | 1 | Active |
| US12290150B2 | Stud for outsole, outsole for cleated shoe, method for producing outsole, and cleated shoe | Performing Operations; Transporting | 0 | Active |
| US11631653B2 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | Electricity | 0 | Active |
| US11569197B2 | Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method | General | 0 | Revoked |
| US11758977B2 | Sole and baseball spike shoe with the sole | Human Necessities | 0 | Active |
| US11217514B2 | Power semiconductor device, method for manufacturing power semiconductor device, and power conversion device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.