Micro-element package having a dual-thickness substrate and manufacturing method thereof
US7589422B2 · kind B2 · utility
19Cited by
0References
5Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 20, 2006 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Jul 31, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package. The micro-element package includes: a substrate having a micro-element on its top surface and a comparatively thin surrounding portion provided around the micro-element; and a circuit board that is electrically connected to the micro-element by utilizing the surrounding portion as a medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.