Hybrid probe for testing semiconductor devices
US7589542B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2007 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Apr 12, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hybrid probe design is presented that includes a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The probe includes a base, a torsion element, a bending element, and a tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Adjusting the position of a pivot can alter the probe's energy absorption characteristics. One or more additional angular elements may be added to change the energy absorption characteristics of the probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.