Method and system for monitoring photolithography processing based on a batch change in light sensitive material
US7591600B2 · kind B2 · utility
1Cited by
1References
31Claims
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Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Apr 1, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70625
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for monitoring photolithography processing includes monitoring application of a light sensitive material to the surface of each of a plurality of substrates and detecting that a supply of the light sensitive material applied to the substrates has changed from a first batch of light sensitive material to a second batch light sensitive material. A change in photolithography process results caused by the change from the first batch to the second batch of light sensitive material is determined. Also included is initiating corrective action based on the change in photolithography process results.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.