Wafer grinding and tape attaching apparatus and method
US7591714B2 · kind B2 · utility
6Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Apr 5, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.