Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
US7591863B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2005 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Jun 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1734
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides a laminating system in which one of second and third substrates for sealing a thin film integrated circuit is supplied to a first substrate having the plurality of thin film integrated circuit while being extruded in a heated and melted state, and further rollers are used for supplying the other substrate, receiving IC chips, separating, and sealing. Processes of separating the thin film integrated circuits provided over the first substrate, sealing the separated thin film integrated circuits, and receiving the sealed thin film integrated circuits can be continuously carried out by rotating the rollers. Thus, the production efficiency can be extremely improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.