Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
US7592250B2 · kind B2 · utility
6Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2007 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Jan 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0959
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.