Technique for forming a thermally conductive interface with patterned metal foil
US7593228B2 · kind B2 · utility
14Cited by
30References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Mar 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive metal foil having at least one patterned surface for facilitating heat dissipation from at least one integrated circuit device to at least one heat sink. The metal foil preferably has a characteristic formability and softness that may be exemplified by alloys of lead, indium, tin, and other malleable metals, and/or composites comprising layers of at least one malleable metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.