Robert N. Jarrett
6Patents
2h-index
7Co-inventors
40Inventor score
Filing activity: Oct 25, 2006 → Dec 19, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7593228B2 | Technique for forming a thermally conductive interface with patterned metal foil | Electricity | 14 | Active |
| US9468136B2 | Low void solder joint for multiple reflow applications | Emerging Cross-Sectional Technologies | 6 | Active |
| US10943796B2 | Semiconductor device assembly having a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 2 | Active |
| US10943795B2 | Apparatus and methods for creating a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US10607857B2 | Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger | Electricity | 1 | Active |
| US10838002B2 | Burn-in preform and method of making the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.