Substrate-imprinting methods
US7594321B2 · kind B2 · utility
1Cited by
34References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2007 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Sep 12, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package includes at least one electronic component mounted on a substrate formed through imprinting. In an embodiment, the substrate may comprise conductive traces, vias, and patterns of lands on one or more layers. Conductor features of different geometries may be formed by imprinting them simultaneously on one or both surfaces of an imprintable tape. Fabrication apparatus and methods, as well as application of the imprinted package to an electronic assembly, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.